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TECHNOL - PRINTED CIRCUIT BOARD TAPES
HOME >> PRODUCTS >> TECHNOL >> PRINTED CIRCUIT BOARD TAPES
Our company
manufactures
and supplies
many kinds
of
PCB
tape. They
are specially
formulated and
designed
to
meet
the
requirements
for the
advanced
printed circuit board technologies
in
the
process
of
hot
air leveling,
gold plating and wave soldering.
Our tapes have good
adhesive
strength, excellent
heat resistant,
chemical
resistant properties,
and without leaving any adhesive residue.
| PCB HOT AIR LEVELING TAPES | ||||||||
| Product Code | Backing | Adhesive | Total Thickness | Adhesion Strength | Tensile Strength | Elongation | Temp. Resistant | Application |
| (mm) | (kg/25mm) | (kg/25mm) | % | (ºC) | ||||
| TN 823 | Red (white)Flat Back Paper /PET | Silicone | 0.21 | 1.25 | 32 | 6 | 260 | Protect gold finger contacts during the hot air leveling process. (horizontal & vertical) |
| (Short Term) | ||||||||
| TN 833 | Red Flat Back Paper /PET | Silicone | 0.24 | 1.25 | 35 | 7 | 260 | |
| (Short Term) | ||||||||
| PCB GOLD PLATING TAPES | ||||||||
| Product Code | Backing | Adhesive | Total Thickness | Adhesion Strength | Tensile Strength | Elongation | Temp. Resistant | Application |
| (mm) | (kg/25mm) | (kg/25mm) | % | (ºC) | ||||
| TN 226 | PVC | Rubber | 0.11 | 0.1 | 5 | 150 | - | Mask PCB during electroplating process to prevent contamination by plating solution. |
| TN 280 | PET | Silicone | 0.072 | 0.8 | 9 | 70 | 200 | Protect the other area of PCB during the gold plating of the ‘fingers’. |
| PCB WAVE SOLDERING TAPES | ||||||||
| Product Code | Backing | Adhesive | Total Thickness | Adhesion Strength | Tensile Strength | Elongation | Temp. Resistant | Application |
| (mm) | (kg/25mm) | (kg/25mm) | % | (ºC) | ||||
| TN 275 | Silicone | 0.06 | 0.5 | 7.5 | 50 | 400 | High heat-resisting insulation purpose and extreme high temp protection up to 400ºC | |
| PI Film | ||||||||
| TN 276 | PI film | Silicone | 0.065 | 0.6 | 7.5 | 50 | 270 | ESD type, extremely low electrostatic discharge at unwind and removal from PWB |
| (short term) | ||||||||
| TN 278 | PI film | Silicone | 0.06 | 0.5 | 7.5 | 50 | 260 | Protect specific areas of PCB, normally the edge connector, during the wave soldering process |
| (short term) | ||||||||
| FPC Tapes | ||||||||
| Product Code | Backing | Adhesive | Total Thickness | Adhesion Strength | Tensile Strength | Elongation | Temp. Resistant | Application |
| (mm) | (kg/25mm) | (kg/25mm) | % | (ºC) | ||||
| TN 225 | PVC | Rubber | 0.08 | 0.035 | 5 | 200 | - | Ideal for protecting FPC |
| TN 238 | PVC | Rubber | 0.08 | 0.03 | 4.5 | 100 | - | Ideal for protecting FPC |
| TN 239 | PVC | Acrylic | 0.09 | 0.24 | 4.5 | 100 | - | With liner |
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